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  • 回流焊的温测试的章程有哪些
  • 成本站编辑:2019免费白菜网址大全设备有限公司通告日期:2018-05-17 17:47 浏览次数:
  • 回流焊2019注册自助领取白菜的主干规律比较简便,其它首先对PCB板的外表贴装元件焊盘印刷锡膏,接下来通过自动贴片机把SMD贴放到预先印制好锡膏的焊盘上。较之后,穿过回流焊接炉,在回流焊炉中逐渐加热,把锡膏融化,称为回流,接着,把PCB板冷却,焊锡凝固,把元件和焊盘牢固地焊接到一起。

    The basic principle of reflow soldering is simple. First, it prints the solder paste on the surface of the surface mounting element of the PCB plate, and then puts the SMD on the solder paste prepared by the automatic patch machine. Finally, through the reflow soldering furnace, gradually heated in the reflow furnace, the solder paste was melted, called reflux, and then the PCB plate was cooled, the solder was solidified, and the components and pads were firmly welded together.

    要得到好的回流焊接效果必须有一番好的回流温度曲线。这就是说什么是一番好的回流曲线呢?一度好的回流曲线应该是对所要焊接的PCB板上的各族表面贴装元件都能够达到可观的焊接,且焊点不仅具有得天独厚的奇观品质而且有上佳的对外品质的温度曲线。

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    A good reflux temperature curve must be provided to achieve good reflow soldering effect. So what is a good reflux curve? A good reflux curve should be a good welding for all the surface mounting elements on the PCB plate to be welded, and the solder joints not only have good appearance quality but also have good internal quality temperature curves.

    而锡膏的特点决定回流曲线之主干特点。不同之锡膏由于助焊剂(Flux)有不同之化学组分,所以他的化学变化有不同之温度要求,对回流温度曲线也有不同之要求。普通锡膏供应商都能提供一个参考回流曲线,他家可在此基础上根据自己之产品特色或结合IPC/JEDEC J-STD-020回流炉测温规范来优化制定出一番回流曲线标准。这就是说应该如何开展回流焊的气温测试呢?

    The characteristics of solder paste determine the basic characteristics of the reflux curve. The solder paste (Flux) has different chemical components because of different solder paste, so its chemical changes have different temperature requirements, and there are different requirements for the reflux temperature curve. Generally, the solder paste supplier can provide a reference reflux curve, and on this basis, the user can optimize the standard of a reflux curve based on its own product characteristics or the IPC/JEDEC J-STD-020 reflow furnace temperature gauge specification. How to test the temperature of reflow soldering?

    高考工具

    test tools

    1.KIC20002019注册自助领取白菜

    1.KIC2000 furnace temperature tester

    非实时测温仪,穿过采样、存储,接下来将采集来之数目上载到计算机进行分析。

    Non real time thermometer, through sampling and storage, then uploads the collected data to the computer for analysis.

    2.热电偶

    2. thermocouple

    用于感受环境温度的腐殖质。伊工作原理是由两种不同成分的导体组成回路,顶测温端和参比端存在温差时回路中就会产生热电流,穿过电流的尺寸来反映外界温度的转变。热电偶一般要求较小直径,因为小直径的品质小,呼唤快,得到的结果较为规范。

    A medium used to feel the temperature of the environment. The principle of its working principle is to make up the circuit of two kinds of conductors with different components. When there is a temperature difference between the temperature measuring end and the reference end, the thermal current will be produced in the loop, and the change of the external temperature is reflected by the size of the current. The thermocouple usually requires smaller diameter, because the small diameter of the mass is small, the response is fast, and the result is more accurate.

    3.其余工具

    3. other tools

    气温焊锡、气温胶带、数量传输线等。

    High temperature solder, high temperature adhesive tape, data transmission line and so on.

    高考点选择原则

    Test point selection principle

    出于线路板上各个区域所承载的元器件不同,此外炉内热空气的流动,这样就造成板上随处温度也不尽相同,所以在现实测量中要实事求是、健全地报告被测产品的温度需要选取合适的统考点。普通遵循以下几个原则。

    Due to the different components of the circuit board and the flow of hot air in the furnace, the temperature of all parts on the board is not the same. Therefore, it is necessary to choose the suitable test point in real and comprehensive measurement of the temperature of the measured product. The following principles are generally followed.

    1.谱允许情况下尽量多步选择测试点;

    1. conditions are allowed to select test points as much as possible.

    2.把测点尽量在同一纵轴线上;

    2. the measured point is on the same longitudinal axis as far as possible.

    3.对温度有特别要求的元器件;

    3. components with special requirements for temperature;

    4.板面温度比较高的职位;

    The position with the highest temperature of 4. plate surface;

    5.板面温度比较低的职位。

    5. the lowest temperature of the plate surface.

    高考方法

    test method

    1.分选合适的统考点;

    1. select the appropriate test points;

    2.名将热电偶按照测试仪的要求固定在基片上,并固定好。线路板选择完全贴装的产品。

    2. fix the thermocouple on the circuit board according to the requirements of the tester, and fix it well. The circuit board selects the fully attached product.

    3.在测试软件中挑选锡膏并设定参数值,名将测试仪与主控PC连片并打开,按照软件上的指导完成操作。

    3. select solder paste and set the parameter value in the test software. Connect the tester to the main control PC and complete the operation according to the prompt on the software.

    4.名将线路板和测试仪投入炉中开展测试,这时设定温区温度和预测温度一致。

    4. the circuit board and tester are sent into the furnace for testing. At this time, the temperature of the temperature zone is consistent with the predicted temperature.

    5.待出炉后将数据线连接,传送炉温数据,传送完毕后模拟出炉温曲线。

    5. the data line will be connected and the furnace temperature data will be transmitted after the furnace is released. After the transmission is completed, the furnace temperature curve will be simulated.

    6.穿过调整使各温区温度达到相当,然后等测试仪冷却后再进行测试,确认无疑后生产。

    6. by adjusting the temperature to achieve the appropriate temperature zone, and then test the instrument cooling after testing, no doubt after the production.

      


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